Process Capability

We have the leading process capability through investing on the latest Technologies and Equipment. Our delivered capability covers the smallest chip 01005, all kind of BGA, PCB size up to 510mm*508mm, 30 Layers board, POP, Flip Chip, Glue and Underfill. We have German Ersa PowerFlow N2 Wave Soldering Machine for mass production, and also Ersa VersaFlow Selective Wave for higher standard work. We have many 3-axis, 4-axis Soldering Robots to eliminate human errors. We have also developed all kind of special processes to serve our customers’ needs, like Washing, Conformal Coating, Parylene Coating, Potting, Wire Bonding and etc.

Testing Capability

In Process Test

  • >3D Solder Paste Inspection
  • >Automatic Optic Inspection
  • >X-Ray Inspection
  • >In Circuit Test
  • >Flying Probe Test

Reliability Test

  • >Environmental Stress Test
  • >Thermal Cycle
  • >hermal Shock
  • >Seal Test
  • >Salt Spray Test
  • >Vibration Test

Functional Test

  • >Customized Functional Test
  • >Lab View

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